The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 1991
Filed:
Feb. 12, 1990
Applicant:
Inventors:
Jorge M Hernandez, Mesa, AZ (US);
Scott Simpson, Woodstock, CT (US);
Assignee:
Rogers Corporation, Rogers, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361388 ; 361387 ; 361405 ; 361421 ; 174 522 ;
Abstract
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.
Quick Actions:
Hernandez, Jorge. (1991). Molded integrated circuit package incorporating heat sink (U.S. Patent No. 5065281). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5065281
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile