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For the Inventor, By the Inventor

Suwon-si, South Korea

Jong-joo Lee

USPTO Granted Patents = 24

Average Co-Inventor Count = 1.5

ph-index = 4

Forward Citations = 74(Granted Patents)


Company Filing History:

goldMedal24 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2006-2018

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24 patents (USPTO):Explore Patents
1. 10128191 - Package-on-package type package including integrated circuit devices and associated passive components on different levels (2018-11-13),
2. RE46666 - Package board having internal terminal interconnection and semiconductor package employing the same (2018-01-08),
3. 9679853 - Package-on-package type package including integrated circuit devices and associated passive components on different levels (2017-06-13),
4. 9400950 - Integrated circuit card socket having a terminal with a loop-shaped portion (2016-07-26),
5. 9391048 - Semiconductor package (2016-07-12),
6. 9165893 - Semiconductor device including coupling conductive pattern (2015-10-20),
7. 8884421 - Multi-chip package and method of manufacturing the same (2014-11-11),
8. 8853854 - Semiconductor package and method of manufacturing the same (2014-10-07),
9. 8796847 - Package substrate having main dummy pattern located in path of stress (2014-08-05),
10. 8723315 - Flip chip package (2014-05-13),
11. 8633579 - Multi-chip package and method of manufacturing the same (2014-01-21),
12. 8625938 - Electronic device having optical communicating part (2014-01-07),
13. 8604616 - Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip (2013-12-10),
14. 8471362 - Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device (2013-06-25),
15. 8446016 - Chip stack package (2013-05-21),

Title: Innovations by Jong-joo Lee: Pioneering Patents in Semiconductor Technology

Introduction: Jong-joo Lee is a prominent inventor based in Suwon-si, South Korea, known for his innovative contributions to the field of semiconductor technology. With an impressive portfolio of 24 patents, Lee's work focuses on advancing packaging techniques for integrated circuit devices, enhancing both performance and efficiency in electronic applications.

Latest Patents: Among his latest notable patents is the development of a package-on-package (PoP) type package, which integrates multiple semiconductor devices and passive components at different levels. This sophisticated design allows a first semiconductor package to contain a passive element and a semiconductor device mounted on a substrate, while a second semiconductor package contains another semiconductor device, establishing electrical connections between them. Additionally, Lee has patented a package board featuring internal terminal interconnections that streamline the electrical connections among various pads on the board's surface, facilitating improved interactions in semiconductor packages.

Career Highlights: Jong-joo Lee's career is deeply intertwined with his role at Samsung Electronics Co., Ltd., where his research and inventions have significantly contributed to the company's advancements in semiconductor technology. His dedication to innovation has led to the development of crucial technologies that have propelled the electronics industry forward.

Collaborations: Lee has collaborated with esteemed colleagues such as Sun-Won Kang and Yong-hoon Kim, pooling their expertise to further enhance the quality and functionality of semiconductor devices. These collaborations have resulted in groundbreaking innovations that address the evolving demands of modern electronics.

Conclusion: Jong-joo Lee remains a significant figure in the realm of semiconductor inventions. His inventive spirit and commitment to excellence have not only enriched his own career but also contributed substantially to the technological advancements at Samsung Electronics Co., Ltd. As the field of semiconductors continues to evolve, Lee's ongoing work and innovative patents promise to play a vital role in shaping the future of electronic devices.

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