The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Sep. 09, 2011
Applicants:

Yong-hoon Kim, Suwon-si, KR;

Jong-joo Lee, Suwon-si, KR;

Sang-youb Lee, Hwaseong-si, KR;

Young-don Choi, Seoul, KR;

Hee-seok Lee, Yongin-si, KR;

Inventors:

Yong-Hoon Kim, Suwon-si, KR;

Jong-Joo Lee, Suwon-si, KR;

Sang-Youb Lee, Hwaseong-si, KR;

Young-Don Choi, Seoul, KR;

Hee-Seok Lee, Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H01L 23/64 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 25/105 (2013.01); H04B 5/0031 (2013.01); H04B 5/0037 (2013.01); H01L 24/48 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/1023 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3511 (2013.01); H04B 5/0012 (2013.01); H04B 5/0075 (2013.01);
Abstract

A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.


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