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Yong-hoon Kim

This inventor holds 36 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology. Active years: 1999-2022.

USPTO Granted Patents = 36 (Patent Applications = 9)

% Patents Active = 91.7

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 184(Granted Patents)

Location History:

Sungnam, KR (1999 - 2001)
Kyungki-do, KR (2001)
Anyang, KR (2003)
Hwaseong-si, KR (2018)
Suwon-si, KR (2012 - 2022)

Company Filing History:

36 out of 132,108

Samsung Electronics Co., Ltd.

patents

2 out of 2,787

Korea Advanced Institute of Science and Technology

patents

where one patent can have more than one assignee

Years Active: 1999-2022

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Areas of Expertise:

Semiconductor Device

Image Sensor Package

Multi-Chip Package

Stacked Package Structure

Electromagnetic Shielding

Heat Dissipation

Bonding Tape

Acousto-Optic Modulator

Phase Shift Mask

Package on Package

Transmitter Array

Conductive Elements

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11309280 - Semiconductor device package (2022-04-19),

2. 10879294 - Image sensor package having multi-level stack structure (2020-12-29),

3. 10727199 - Electronic device including semiconductor device package (2020-07-28),

4. 10699983 - Semiconductor package (2020-06-30),

5. 10541263 - Image sensor package having multi-level stack structure (2020-01-21),

6. 10038010 - Semiconductor device (2018-07-31),

7. 9691691 - Semiconductor package with sidewall contacting bonding tape (2017-06-27),

8. 9634750 - Beamforming method and apparatus for serving multiple users (2017-04-25),

9. 9570383 - Semiconductor package, module substrate and semiconductor package module having the same (2017-02-14),

10. 9520387 - Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer (2016-12-13),

11. 9520373 - Semiconductor package (2016-12-13),

12. 9496226 - Semiconductor device, semiconductor package, and electronic device (2016-11-15),

13. 9472539 - Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip (2016-10-18),

14. 9362235 - Semiconductor package (2016-06-07),

15. 9165893 - Semiconductor device including coupling conductive pattern (2015-10-20),

Title: The Innovative Journey of Yong-hoon Kim

Introduction:

Yong-hoon Kim, a talented inventor hailing from Suwon-si, South Korea, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Yong-hoon Kim's latest patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we perceive transportation and safety on the roads.

Career Highlights:

With a career spanning over two decades, Yong-hoon Kim has worked tirelessly to bring his ideas to life. His dedication to research and development has led to the creation of cutting-edge solutions in the tech industry.

Collaborations:

Throughout his career, Yong-hoon Kim has collaborated with leading tech companies and research institutions to further his inventions. His ability to work in multidisciplinary teams has resulted in the successful implementation of his innovative ideas.

Conclusion:

In conclusion, Yong-hoon Kim's passion for innovation and his relentless drive to push the boundaries of technology have solidified his position as a respected inventor in the industry. His contributions continue to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.

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