The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Aug. 12, 2011
Un-byoung Kang, Hwaseong-si, KR;
Jong-joo Lee, Suwon-si, KR;
Yong-hoon Kim, Suwon-si, KR;
Tae-hong Min, Gumi-si, KR;
Un-Byoung Kang, Hwaseong-si, KR;
Jong-Joo Lee, Suwon-si, KR;
Yong-Hoon Kim, Suwon-si, KR;
Tae-Hong Min, Gumi-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.