Hwaseong-si, South Korea

Tae-Hong Min

USPTO Granted Patents = 25 

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 264(Granted Patents)


Location History:

  • Gumi-si, KR (2013 - 2014)
  • Yongin-si, KR (2014 - 2016)
  • Hwaseong, KR (2017)
  • Suwon-si, KR (2021 - 2023)
  • Hwaseong-si, KR (2017 - 2024)

Company Filing History:


Years Active: 2013-2024

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25 patents (USPTO):

Title: Tae-Hong Min: Innovator in Semiconductor Packaging

Introduction

Tae-Hong Min is a prominent inventor based in Hwaseong-si, South Korea. With a remarkable portfolio of 25 patents to his name, he has made significant contributions to the field of semiconductor technology. His innovative designs and solutions have greatly enhanced the reliability and performance of semiconductor packages.

Latest Patents

Among his latest innovations is a notable patent for a semiconductor package having high reliability. This advanced semiconductor package comprises a package substrate supporting multiple semiconductor devices stacked atop one another. The clever integration of a plurality of underfill fillets positioned between these devices ensures stability and minimizes the risk of damage. Furthermore, the molding resin encases both the semiconductor devices and the underfill fillets, safeguarding them from environmental factors. The underfill fillets are designed with protrusions that occupy the spaces between the semiconductor devices and the package substrate. Intriguingly, at least two neighboring protrusions form a seamless continuous structure, eliminating any interface between them, thus enhancing structural integrity.

Career Highlights

Throughout his career, Tae-Hong Min has worked with leading companies in the technology sector, including Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd. His roles in these organizations have allowed him to refine his expertise and innovate at a high level, making substantial contributions to various projects in semiconductor development.

Collaborations

Min's innovative journey has been enriched through collaboration with talented individuals such as Myung-Sam Kang and Young-Gwan Ko. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.

Conclusion

Tae-Hong Min stands out as an exemplary inventor in the realm of semiconductor packaging. His dedication to innovation is evident through his numerous patents and collaborations with reputable companies and professionals. As technology continues to advance, Min's contributions will undoubtedly play a vital role in shaping the future of semiconductor reliability.

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