Hwaseong, South Korea

Tae-Hong Min

This inventor holds 25 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tae-Hong Min. Retrieved from https://idiyas.com/inventor/tae-hong-min-m6db0i68

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 25 

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 272(Granted Patents)


Location History:

  • Gumi-si, KR (2013 - 2014)
  • Yongin-si, KR (2014 - 2016)
  • Hwaseong, KR (2017)
  • Suwon-si, KR (2021 - 2023)
  • Hwaseong-si, KR (2017 - 2024)

Company Filing History:


Years Active: 2013-2024

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Areas of Expertise:
Semiconductor Package
High Reliability
Circuit Board
Multi-Chip Package
Inductor Device
Stacked Chips
TSV Interconnects
Manufacturing Method
Printed Circuit Board
Assembly
Chip-Stacked
Underfill Material
25 patents (USPTO):Explore Patents

Title: Tae-Hong Min: Innovator in Semiconductor Packaging

Introduction

Tae-Hong Min is a prominent inventor based in Hwaseong-si, South Korea. With a remarkable portfolio of 25 patents to his name, he has made significant contributions to the field of semiconductor technology. His innovative designs and solutions have greatly enhanced the reliability and performance of semiconductor packages.

Latest Patents

Among his latest innovations is a notable patent for a semiconductor package having high reliability. This advanced semiconductor package comprises a package substrate supporting multiple semiconductor devices stacked atop one another. The clever integration of a plurality of underfill fillets positioned between these devices ensures stability and minimizes the risk of damage. Furthermore, the molding resin encases both the semiconductor devices and the underfill fillets, safeguarding them from environmental factors. The underfill fillets are designed with protrusions that occupy the spaces between the semiconductor devices and the package substrate. Intriguingly, at least two neighboring protrusions form a seamless continuous structure, eliminating any interface between them, thus enhancing structural integrity.

Career Highlights

Throughout his career, Tae-Hong Min has worked with leading companies in the technology sector, including Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd. His roles in these organizations have allowed him to refine his expertise and innovate at a high level, making substantial contributions to various projects in semiconductor development.

Collaborations

Min's innovative journey has been enriched through collaboration with talented individuals such as Myung-Sam Kang and Young-Gwan Ko. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.

Conclusion

Tae-Hong Min stands out as an exemplary inventor in the realm of semiconductor packaging. His dedication to innovation is evident through his numerous patents and collaborations with reputable companies and professionals. As technology continues to advance, Min's contributions will undoubtedly play a vital role in shaping the future of semiconductor reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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