Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Tae-Hong Min

Myung-Sam Kang

Young-Gwan Ko

Sang-Sick Park

Geol Nam

Ji-Hwan Hwang

Jung-Hwan Kim

Un-Byoung Kang

Tae-Je Cho

Young-kun Jee

Yong-hoon Kim

Sang-Uk Han

Jong-joo Lee

Tae-joo Hwang

Ju-Ho Kim

Min-Jae Seong

Yeong-Hwan Choe

Jungwoo Choi

Sun-Pil Youn

Sun-kyoung Seo

Yun-Hyeok Im

Hyun-Jung Song

Kwang-Chul Choi

Chung-Sun Lee

Hyung-Sun Jang

Hyuek-Jae Lee

Youn-Soo Seo

Young-Kun Jee

Eun-Mi Kim

Jong-Yeon Kim

Ji-sun Hong

Hyon-chol Kim

Ji-hwan Hwang

Jong-Yun Myung

Chung-sun Lee

In-Seok Kim

Jung-Han Lee

Yeong-kwon Ko

Eun-kyoung Choi

Yong-Jin Park

A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

Semiconductor package having a high reliability

Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.

Inductor device and method of manufacturing the same

A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.

Printed circuit board

A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

Printed circuit board and package including printed circuit board

A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.

Printed circuit board and package having the same

A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

Circuit board and manufacturing method thereof

A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.

A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one through-silicon-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.

Semiconductor device having stacked semiconductor chips interconnected via TSV

A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

Circuit board and assembly thereof

Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.

Circuit board

Growing community of inventors

Hwaseong-si, South Korea

Tae-Hong Min