The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Oct. 24, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jungwoo Choi, Suwon-si, KR;
Tae-hong Min, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/0047 (2013.01); H05K 3/32 (2013.01); H05K 3/361 (2013.01); H05K 3/4038 (2013.01); H05K 3/4623 (2013.01); H05K 1/0298 (2013.01); H05K 1/18 (2013.01);
Abstract
A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.