Kuna, ID, United States of America

John VanNortwick

This inventor holds 33 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Micro Technology, Inc.. Active years: 2000-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John VanNortwick. Retrieved from https://idiyas.com/inventor/john-vannortwick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 57.6

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 90(Granted Patents)


Location History:

  • Boise, ID (US) (2000 - 2003)
  • Kuns, ID (US) (2005)
  • Kuna, ID (US) (2001 - 2009)

Company Filing History:


Years Active: 2000-2009

Loading Chart...
Areas of Expertise:
Stencil Print Quality
Flip-Chip Assembly
In-Line Testing
Semiconductor Components
Automated Attachment
Thermoplastic Polymer
Fiducial Monitoring
Lead-On-Chip Leadframes
33 patents (USPTO):Explore Patents

Title: Innovations by John VanNortwick: A Trailblazer in Semiconductor Technology

Introduction

John VanNortwick, hailing from Kuna, ID, is a prolific inventor with an impressive portfolio of 33 patents. His contributions to the field of semiconductor technology have paved the way for advancements in manufacturing processes, particularly in stencil/screen printing and flip-chip assembly testing.

Latest Patents

Two of his latest patents showcase his innovative approach to enhancing quality and efficiency in semiconductor manufacturing. The first, "Apparatus for improving stencil/screen print quality," presents a method and apparatus designed to improve print quality by utilizing a specialized stencil that retards the running of printable materials and supports better spreading onto substrates. This innovation is significant during processes like lead-on-chip packaging, where precision is crucial.

The second patent, "Method for in-line testing of flip-chip semiconductor assemblies," provides a revolutionary solution for testing flip-chip assemblies before encapsulation. This method allows for the electrical testing of integrated circuit dice against substrate interconnections using special sockets or probes. By enabling testing before the curing of epoxy, it addresses potential failures more effectively and eliminates the need for complex repair procedures.

Career Highlights

Throughout his career, John VanNortwick has influenced the semiconductor industry while working with notable organizations such as Micron Technology and Micro Technology, Inc. His expertise in semiconductor processes has made him a valued asset in any team he has joined.

Collaborations

John has collaborated with various professionals in his field, including colleagues like Chad A. Cobbley and Tongbi T. Jiang, enhancing the innovation landscape with their collective expertise.

Conclusion

John VanNortwick stands as a remarkable figure in the realm of innovations related to semiconductor technology. His 33 patents reflect a commitment to quality and efficiency in manufacturing processes, reaffirming his status as a leading inventor in the industry. His work continues to inspire upcoming innovations, ensuring advancements in semiconductor applications for the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…