The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7476277 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 13, 2009

Filed:

Nov. 04, 2003
Applicants:

Tongbi Jiang, Boise, ID (US);

Chad A. Cobbley, Boise, ID (US);

John Vannortwick, Kuna, ID (US);

Inventors:

Tongbi Jiang, Boise, ID (US);

Chad A. Cobbley, Boise, ID (US);

John VanNortwick, Kuna, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.


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