Saint Paul, MN, United States of America

Joel Arthur Gerber


Average Co-Inventor Count = 2.9

ph-index = 9

Forward Citations = 468(Granted Patents)


Location History:

  • Saint Paul, MN (US) (1987 - 2004)
  • Orono, MN (US) (2007)

Company Filing History:


Years Active: 1987-2007

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10 patents (USPTO):Explore Patents

Title: Innovations of Joel Arthur Gerber

Introduction

Joel Arthur Gerber is a notable inventor based in Saint Paul, MN (US). He holds a total of 10 patents, showcasing his significant contributions to the field of technology and engineering. His work primarily focuses on methods for enhancing the connection between integrated circuit chips and circuit substrates.

Latest Patents

One of his latest patents is titled "Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding." This invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes pre-applying adhesive directly to the bumped side of an integrated circuit chip. It also involves removing portions of the adhesive from the tips of the solder bumps to expose a contact surface. The bumped side of the integrated circuit chip, which has been coated with adhesive, is then pressed against the circuit substrate, allowing the bumps to provide an electrical connection. The adhesive is removed from the tips of the solder bumps using a solvent-assisted wiping action, forming a bond between the integrated circuit chip and the circuit substrate.

Another significant patent is "Circuit elements using z-axis interconnect." This patent discloses methods for producing circuit elements and the resultant circuit elements. A precursor circuit element includes a first insulating layer with a conductor and an electrically conducting member or bump protruding from the conductor. A second insulating layer, which includes an adhesive, is placed onto the precursor circuit element, assuming the shape of the aforementioned surface. A portion of the insulating layer is removed near the apex of the bump to expose part of the bump for sufficient electrical connection with a subsequent circuit element.

Career Highlights

Throughout his career, Joel has worked with prominent companies such as 3M Innovative Properties Company and Minnesota Mining and Manufacturing Company. His experience in these organizations has allowed him to develop and refine his innovative ideas.

Collaborations

Joel has collaborated with notable individuals in his field, including Yu Chen and Peter B. Hogerton. These collaborations have contributed to the advancement of his inventions and patents.

Conclusion

Joel Arthur Gerber's contributions to the field of technology through his patents and collaborations highlight his innovative spirit and dedication to advancing integrated circuit technology. His work continues to influence the industry and inspire future inventors.

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