The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Oct. 17, 2000
Peter B. Hogerton, White Bear Lake, MN (US);
Kevin Yu Chen, San Diego, CA (US);
Joel A. Gerber, Orono, MN (US);
Robert L. D. Zenner, Minneapolis, MN (US);
Peter B. Hogerton, White Bear Lake, MN (US);
Kevin Yu Chen, San Diego, CA (US);
Joel A. Gerber, Orono, MN (US);
Robert L. D. Zenner, Minneapolis, MN (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.