Location History:
- Eagan, MN (US) (2001)
- San Diego, CA (US) (2007)
Company Filing History:
Years Active: 2001-2007
Title: Innovator Spotlight: Kevin Yu Chen from Eagan, MN
Introduction: Kevin Yu Chen is a notable inventor based in Eagan, Minnesota, recognized for his contributions to electronic circuit technology. With two patents to his name, he has significantly impacted the field of integrated circuits and high-density packaging.
Latest Patents: Kevin's latest inventions include a patent for "Solvent Assisted Burnishing of Pre-Underfilled Solder Bumped Wafers for Flipchip Bonding." This innovative method enhances the connection process between integrated circuit chips and circuit substrates. The technique involves pre-applying adhesive to the bumped side of the chip and using a solvent-assisted wiping action to expose the contact surface of the solder bumps, ensuring strong electrical connections.
The second patent is titled "High Density Electronic Package," which describes an ultra-thin circuit package featuring a thinned electronic device. This package, with a total thickness of less than 275 μm, utilizes a flexible circuit substrate and a minimal adhesive layer. Kevin's design also allows for stacking and laminating multiple circuit packages to create high-density three-dimensional electronic circuits.
Career Highlights: Kevin Yu Chen is a member of the 3M Innovative Properties Company, a subsidiary renowned for its innovative research and development in various technology sectors. His role at 3M enables him to contribute significantly to advancements in electronic packaging techniques.
Collaborations: Throughout his career, Kevin has collaborated with notable colleagues such as Joel Arthur Gerber and Robert L. D. Zenner. Working alongside these talented individuals, he has furthered his research and expanded the impact of his inventions.
Conclusion: Kevin Yu Chen's inventive contributions have played a vital role in the evolution of electronic circuit technology. With a keen focus on enhancing connectivity methods and creating high-density electronic packages, his work continues to influence the industry, driving innovation in circuit design and manufacturing.