The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Nov. 25, 1998
Applicant:
Inventors:
Robert L. D. Zenner, Minneapolis, MN (US);
Joel Arthur Gerber, St. Paul, MN (US);
Kevin Yu Chen, Eagan, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ; H05K 1/14 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H05K 1/16 ; H05K 1/14 ; H05K 1/11 ;
Abstract
The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100 &mgr;m; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25 &mgr;m between the electronic device and the circuit substrate. The circuit package is less than about 275 &mgr;m thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.