Robert L D Zenner

Title: Innovations of Robert L D Zenner

Introduction

Robert L D Zenner is a notable inventor based in Minneapolis, MN (US). He has made significant contributions to the field of electronic adhesives, holding a total of 3 patents. His work focuses on innovative methods and compositions that enhance the performance and reliability of electronic components.

Latest Patents

One of his latest patents is for low temperature bonding electronic adhesives. This invention provides adhesive compositions that comprise a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments of this patent also include one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using these compositions are also provided.

Another significant patent by Zenner is related to solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding. This invention outlines a method for connecting an integrated circuit chip to a circuit substrate. The method includes pre-applying adhesive directly to a bumped side of an integrated circuit chip, removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip against the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent-assisted wiping action, forming a bond between the integrated circuit chip and the circuit substrate.

Career Highlights

Robert L D Zenner is associated with 3M Innovative Properties Company, where he continues to develop cutting-edge technologies in the field of electronics. His work has been instrumental in advancing the capabilities of electronic adhesives, making them more effective and reliable.

Collaborations

Throughout his career, Zenner has collaborated with talented individuals such as Kevin Yu Chen and Joel Arthur Gerber. These collaborations have contributed to the successful development of his innovative patents.

Conclusion

Robert L D Zenner's contributions to the field of electronic adhesives demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and methods that enhance electronic connectivity.