The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Dec. 08, 1997
Yu Chen, St. Paul, MN (US);
Joel A Gerber, St. Paul, MN (US);
Brian E Schreiber, Oakdale, MN (US);
Joshua W Smith, Corvallis, OR (US);
3M Innovative Properties Company, Saint Paul, MN (US);
Abstract
Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.