The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1997
Filed:
Jan. 23, 1995
Applicant:
Inventors:
Joel A Gerber, St. Paul, MN (US);
Peter A Gits, White Bear Lake, MN (US);
Assignee:
Minnesota Mining and Manufacturing Company, St. Paul, MN (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
156150 ; 156292 ; 156295 ; 29830 ; 29852 ; 427 97 ;
Abstract
A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.