The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1999
Filed:
Jul. 23, 1996
Yu Chen, St. Paul, MN (US);
Joel Arthur Gerber, St. Paul, MN (US);
Joshua Woodward Smith, St. Paul, MN (US);
Minnesota Mining and Manufacturing Company, St. Paul, MN (US);
Abstract
Method for making Z-axis interconnections between adjacent circuit layers with electrically conductive traces, in multi-layered circuits, include connecting a conducting member of a deformable material to a circuit board layer and depositing an adhesive layer over an adjacent circuit board layer. The adjacent circuit layers are aligned, with the conducting member substantially collinear with the conductive traces of the adjacent circuit layers, and the circuit layers are brought together by pressure, such that the conducting member penetrates the adhesive layer and deforms until it 'cracks'. The cracking exposes fresh (unoxidized) material that contacts a conductive trace, joining the circuit layers together and creating a low resistance electrical connection. The adhesive serves to bound expansion of the deformable conducting member, reducing any potential contacts with adjacent conducting members.