Hsinchu, Taiwan

Jiun-Ting Chen


Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Hsin-Chu Hsien, TW (2011)
  • Hsinchu, TW (2018 - 2024)

Company Filing History:


Years Active: 2011-2025

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9 patents (USPTO):Explore Patents

Title: Innovations by Inventor Jiun-Ting Chen

Introduction

Jiun-Ting Chen is a noted inventor based in Hsinchu, Taiwan. With a remarkable portfolio of nine patents, he has made significant contributions to the field of semiconductor technology. His inventions focus primarily on semiconductor packaging and manufacturing methodologies that enhance performance and efficiency.

Latest Patents

Among his latest innovations, Jiun-Ting Chen has developed a novel semiconductor package and its associated manufacturing method. This semiconductor package features a configuration that includes at least one semiconductor die, an interposer, an encapsulant, a protection layer, and connectors. The interposer is designed with slanted sidewalls, connecting its first and second surfaces, which optimally facilitates electrical connections between the semiconductor die and the interposer. Additionally, his chip package structure innovation incorporates features such as a substrate, two chip structures, and an anti-warpage bar, all aimed at improving structural integrity and performance.

Career Highlights

Jiun-Ting Chen has held key positions at prominent firms in the semiconductor industry. He has worked with Taiwan Semiconductor Manufacturing Company Ltd. and Novatek Microelectronics Corporation, where he contributed his expertise to various groundbreaking projects in semiconductor packaging and manufacturing.

Collaborations

Throughout his career, Jiun-Ting Chen has collaborated with esteemed colleagues in the industry, including Chih-Wei Wu and Szu-Wei Lu. These partnerships have allowed for the exchange of innovative ideas and have fostered advancements in their respective projects.

Conclusion

Jiun-Ting Chen stands out as a pioneering inventor whose work in semiconductor technology continues to shape the industry. His extensive patent portfolio, marked by innovative designs and methodologies, reflects his commitment to advancing semiconductor packaging and manufacturing techniques. Through his collaborations and career achievements, he has proven to be a valuable asset to the field of innovation.

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