Jiun-Heng Wang

Title: Jiun-Heng Wang: Innovator in Semiconductor Technology

Introduction

Jiun-Heng Wang is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative manufacturing processes and device structures that enhance the performance and reliability of semiconductor devices.

Latest Patents

Wang's latest patents include a semiconductor device and its manufacturing process. This semiconductor device features a circuit structure with multiple contacts and a protective layer that has various openings and protrusions. The design ensures that the contacts are effectively exposed while maintaining structural integrity. Another significant patent is related to a chip packaging process. This process involves a bumping technique that includes forming a protective layer with openings that expose contacts, followed by the creation of bumps that are etched to achieve a planar surface. These innovations are crucial for advancing semiconductor manufacturing techniques.

Career Highlights

Throughout his career, Jiun-Heng Wang has worked with prominent companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor device design and manufacturing processes.

Collaborations

Wang has collaborated with several professionals in his field, including Yeong-Ching Chao and An-Hong Liu. These collaborations have contributed to the advancement of semiconductor technologies and have fostered innovation within the industry.

Conclusion

Jiun-Heng Wang's contributions to semiconductor technology through his patents and career achievements highlight his role as an influential inventor. His work continues to impact the field, paving the way for future advancements in semiconductor devices and manufacturing processes.