Chipmos Technologies Inc.

Chipmos Technologies (bermuda) Ltd

Jiun-Heng Wang

An-Hong Liu

Yeong-Ching Chao

A semiconductor device including a circuit structure and a protective layer is provided. The circuit structure has multiple contacts. The protective layer is located on the circuit structure and has multiple openings and multiple protrusions, wherein the contacts are exposed by the openings and the protrusions are located on the contacts.

Semiconductor device and manufacturing process thereof

A bumping process including the following steps is provided. A main body with a plurality of contacts thereon is provided. A protective layer with a plurality of first openings is formed on the main body. The first openings in the protective layer expose the respective contacts. An under-bump-metallurgy layer is formed on the protective layer and the contacts. A patterned photoresist layer having a plurality of second openings located above their corresponding first openings is formed over the under-bump-metallurgy layer. A plurality of bumps is formed inside the second openings above their corresponding contacts such that the level of the surface of the bumps away from the protective layer is lower than that of the photoresist layer. The bumps are etched to planarize the surfaces of the bumps. The patterned photoresist layer and part of the under-bump-metallurgy layer not covered by the bumps are removed.

Chip packaging process

A method for manufacturing a probe card is provided. A first inactive layer, a first patterned photoresist layer and a first metal layer are sequentially formed on a substrate. The first metal layer has first through holes exposing a portion of the first patterned photoresist layer. A second inactive layer and a second patterned photoresist layer are sequentially formed thereon. The second patterned photoresist layer has second through holes exposing the first through holes. Pins are formed inside the first and the second through holes. A second metal layer is formed on the second patterned photoresist layer. One end of each pin is connected to the second metal layer. The pins and the second metal layer are taken out. A circuit carrier having third through holes is provided. The pins are inserted into the third through holes. The second metal layer is patterned to form pinheads.

Method for manufacturing probe card

A method of manufacturing an injector plate is provided where a wafer is provided and a release layer is disposed on the wafer. Then a photo resist is formed over the release layer. After photolithography processing, a plurality of plugs are formed from the photo resist. A titanium layer is sputtered on the release layer and on the plurality of plugs. The plugs are removed so that the titanium layer has a plurality of openings. An injector plate fabricated from this method has the characteristics of biocompatibility with a plurality of fine-pitch openings with uniform diameters.

Growing community of inventors

Tainan County, Taiwan

Jiun-Heng Wang