This inventor holds 5 USPTO granted patents and 3 published patent applications and 2 EPO patents. Top assignee: Vayo (Shanghai) Technology Co., Ltd.. Active years: 2020-2025.
Company Filing History:
4 out of 7 Years Active: 2020-2025
Title: Jishuo Liu: Innovator in System-in-Package Technology
Introduction
Jishuo Liu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of system-in-package technology, holding a total of 5 patents. His innovative work focuses on improving design processes and manufacturing efficiency in electronic components.
Latest Patents
Liu's latest patents include a "System-in-package technology-based process design method and system, medium, and device." This invention outlines a method for acquiring design data and three-dimensional model data, which are then integrated into an efficient package model. The process allows for assembly analysis to identify design flaws and generate manufacturing programs. Another notable patent is the "Stencil step design method and system, computer readable storage medium, and device." This method automates the design of stencil apertures for electronic components, achieving over 90% automation and eliminating the need for manual intervention.
Career Highlights
Jishuo Liu is currently employed at Vayo (Shanghai) Technology Co., Ltd., where he continues to develop innovative solutions in electronic design and manufacturing. His work has significantly impacted the efficiency and effectiveness of production processes in the industry.
Collaborations
Liu collaborates with talented coworkers such as Shengjie Qian and Fengshou Liu, contributing to a dynamic team focused on advancing technology in their field.
Conclusion
Jishuo Liu's contributions to system-in-package technology and his innovative patents highlight his role as a leading inventor in the electronics industry. His work continues to pave the way for advancements in design and manufacturing processes.