The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Apr. 22, 2020
Vayo (Shanghai) Technology Co., Ltd., Shanghai, CN;
Shengjie Qian, Shanghai, CN;
Jihong Wu, Shanghai, CN;
Jishuo Liu, Shanghai, CN;
Fengshou Liu, Shanghai, CN;
Vayo (Shanghai) Technology Co., Ltd., Shanghai, CN;
Abstract
A system-in-package technology-based process design method and system, a computer readable storage medium, and a device. The system-in-package technology-based process design method includes: acquiring design data of a layout and three-dimensional model data associated with the layout; associating and matching the design data with the three-dimensional model data according to the designed components' attribute information in the design data, and assembling the design data and the three-dimensional model data into an integrated package model; and performing assembly process analysis on the integrated package model to identify unreasonable design points used for design modifications and references, or directly exporting, from the integrated package model, a packaging process manufacturing program for fabrication.