Company Filing History:
1 out of 7 
1 out of 8 Years Active: 2024-2025
Title: Jihong Wu: Innovator in System-in-Package Technology
Introduction
Jihong Wu is a prominent inventor based in Shanghai, China, known for his contributions to system-in-package technology. With a total of 2 patents, he has made significant advancements in the field of electronic design and manufacturing.
Latest Patents
Wu's latest patents include a "System-in-package technology-based process design method and system, medium, and device." This innovation encompasses a comprehensive method for acquiring design data and integrating it with three-dimensional model data to create an efficient packaging process. His second patent, "Surface mount data conversion method, system, medium and device based on component three-dimensional database," focuses on creating a component 3D database to streamline circuit board production, thereby reducing errors and enhancing efficiency.
Career Highlights
Throughout his career, Jihong Wu has worked with notable companies such as Vayo Technology Co., Ltd. and China Resources Microelectronics. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technology in the electronics sector.
Collaborations
Wu has collaborated with talented individuals in his field, including Shengjie Qian and Jishuo Liu. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Jihong Wu's work in system-in-package technology and surface mount data conversion has positioned him as a key figure in the electronics industry. His patents reflect a commitment to improving design processes and manufacturing efficiency.