Daejeon, South Korea

Jin Yong An

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 31(Granted Patents)


Location History:

  • Gyunggi-do, KR (2012 - 2014)
  • Daejeon, KR (2009 - 2015)

Company Filing History:


Years Active: 2009-2015

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6 patents (USPTO):Explore Patents

Title: Innovations of Jin Yong An

Introduction

Jin Yong An is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of electronics, particularly in the manufacturing of printed circuit boards and substrates. With a total of 6 patents to his name, his work has had a substantial impact on the industry.

Latest Patents

Jin Yong An's latest patents include a method of manufacturing printed circuit boards with metal bumps. This innovative method involves applying a dry film on a carrier, patterning the dry film to form holes for metal bumps, and creating an upper circuit layer with connection pads. Additionally, he has developed a method of manufacturing substrates using a carrier. This process includes preparing a carrier with a releasing layer and forming solder resist layers on the buildup layers.

Career Highlights

Jin Yong An is currently employed at Samsung Electro-Mechanics Co., Ltd. His work at this leading company has allowed him to push the boundaries of technology in the electronics sector. His innovative approaches have garnered attention and respect within the industry.

Collaborations

Jin Yong An has collaborated with notable coworkers, including Myung Sam Kang and Jae Joon Lee. These partnerships have contributed to the successful development of his patents and innovations.

Conclusion

Jin Yong An's contributions to the field of electronics through his patents and innovative methods have established him as a key figure in the industry. His work continues to influence the manufacturing processes of printed circuit boards and substrates, showcasing the importance of innovation in technology.

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