The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Dec. 28, 2007
Shuhichi Okabe, Gyunggi-do, KR;
Je Gwang Yoo, Gyunggi-do, KR;
Chang Sup Ryu, Gyunggi-do, KR;
Myung Sam Kang, Daejeon, KR;
Jung Hyun Park, Gyunggi-do, KR;
Ji Hong JO, Chungcheongnam-do, KR;
Jin Yong an, Daejeon, KR;
Soon OH Jung, Gyunggi-do, KR;
Shuhichi Okabe, Gyunggi-do, KR;
Je Gwang Yoo, Gyunggi-do, KR;
Chang Sup Ryu, Gyunggi-do, KR;
Myung Sam Kang, Daejeon, KR;
Jung Hyun Park, Gyunggi-do, KR;
Ji Hong Jo, Chungcheongnam-do, KR;
Jin Yong An, Daejeon, KR;
Soon Oh Jung, Gyunggi-do, KR;
Samsung Electro-Mechanics, Co., Ltd., Suwon, KR;
Abstract
Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.