The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Sep. 02, 2009
Applicants:
Jin Yong an, Gyunggi-do, KR;
Seok Kyu Lee, Gyunggi-do, KR;
Inventors:
Jin Yong An, Gyunggi-do, KR;
Seok Kyu Lee, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.
An, Jin. (2012). Method of manufacturing printed circuit board having metal bump (U.S. Patent No. 8209860). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8209860
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile