The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Mar. 13, 2009
Applicants:
Jin Yong an, Daejeon, KR;
Jae Joon Lee, Gyunggi-do, KR;
Inventors:
Jin Yong An, Daejeon, KR;
Jae Joon Lee, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.
An, Jin. (2012). Printed circuit board comprising metal bumps integrated with connection pads (U.S. Patent No. 8207450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8207450
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile