Jin Won Jeong

Title: Innovations of Jin Won Jeong in Semiconductor Technology

Introduction

Jin Won Jeong is a prominent inventor based in Seoul, South Korea, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, he has made remarkable advancements in the field, particularly in semiconductor die forming and packaging methods.

Latest Patents

One of his latest patents is a semiconductor die forming and packaging method using ultrashort pulse laser micromachining. This innovative method involves preparing a wafer, forming a low-k dielectric layer on the wafer, and creating a metal pad on the low-k dielectric layer. The process continues with the formation of a passivation layer on the metal pad, followed by patterning the passivation layer. The low-k dielectric layer is then laser-grooved using an ultrashort pulse laser, and the wafer is cut by mechanical sawing to form one or more semiconductor dies. Another notable patent is the fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die. This method includes forming a bump on a wafer, applying a coating film over the bump, and laser grooving the wafer. Plasma etching is performed on the grooved wafer, followed by the removal of the coating film to expose the bump. The semiconductor die is then fabricated through mechanical sawing of the wafer and subsequently packaged.

Career Highlights

Jin Won Jeong has worked with notable companies such as Magnachip Semiconductor, Inc. and Coupang Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Throughout his career, Jin Won Jeong has collaborated with talented individuals, including Jae Sik Choi and Byeung Soo Song. These collaborations have further enhanced his work and contributions to the field.

Conclusion

Jin Won Jeong's innovative work in semiconductor technology has led to significant advancements in the industry. His patents reflect a deep understanding of the complexities involved in semiconductor die forming and packaging. His contributions continue to influence the field and inspire future innovations.