The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
May. 18, 2022
Applicant:
Magnachip Semiconductor, Ltd., Cheongju-si, KR;
Inventors:
Assignee:
MagnaChip Semiconductor, Ltd., Cheongju-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 77/10 (2023.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 25/16 (2023.01); H01L 21/78 (2006.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/268 (2013.01); H01L 21/3043 (2013.01); H01L 21/3065 (2013.01); H01L 21/78 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); H01L 25/167 (2013.01); H10K 71/00 (2023.02); H10K 77/111 (2023.02); H01L 2224/0401 (2013.01);
Abstract
A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.