The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
May. 30, 2018
Magnachip Semiconductor, Ltd., Cheongju-si, KR;
Jae Sik Choi, Cheongju-si, KR;
Jin Won Jeong, Seoul, KR;
Young Sug Seong, Cheongju-si, KR;
Dong Keun Lee, Cheongju-si, KR;
MagnaChip Semiconductor, Ltd., Cheongju-si, KR;
Abstract
A test socket of a flexible semiconductor chip package includes a first bending jig having a convex contour, a second bending jig having a concave contour, and a semiconductor chip package. The second bending jig is disposed to matingly engage the first bending jig. The semiconductor chip package is disposed between the first bending jig and the second bending jig, and includes a flexible tape and a semiconductor chip. The semiconductor chip is disposed on a surface of the flexible tape. Each of the first and second bending jigs has a horizontal length longer than a length of the semiconductor chip and less than a length of the flexible tape.