Jin Seon Park

This inventor holds 14 USPTO granted patents and 9 published patent applications and 1 EPO patent. Top assignees: Industry-University Cooperation Foundation Hanyang University, Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd.. Active years: 2012-2024.

USPTO Granted Patents = 14 (Patent Applications = 9)

% Patents Active = 78.6

EPO Patents = 1 (Patent Applications = 4)

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 19(Granted Patents)

Location History:

Chungcheongnam-do, KR (2012 - 2014)
Seoul, KR (2013 - 2023)
Suwon-si, KR (2022 - 2024)

Company Filing History:

6 out of 1,229

Industry-University Cooperation Foundation Hanyang University

patents

6 out of 7,633

Samsung Electro-Mechanics Co., Ltd.

patents

2 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2012-2024

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11909099 - Antenna module (2024-02-20),

2. 11732354 - Method and apparatus for forming layer, metal oxide transistor and fabrication method thereof (2023-08-22),

3. 11630482 - Display apparatus (2023-04-18),

4. 11539138 - Chip radio frequency package and radio frequency module (2022-12-27),

5. 11177449 - P-type semiconductor layer, P-type multilevel element, and manufacturing method for the element (2021-11-16),

6. 11015243 - Method and apparatus for forming layer, metal oxide transistor and fabrication method thereof (2021-05-25),

7. 10991831 - Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element (2021-04-27),

8. 10985247 - Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element (2021-04-20),

9. 10978561 - Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element (2021-04-13),

10. 8881382 - Embedded printed circuit board and method of manufacturing the same (2014-11-11),

11. 8826527 - Electronic component-embedded printed circuit board and method of manufacturing the same (2014-09-09),

12. 8552305 - Electronic component-embedded printed circuit board (2013-10-08),

13. 8339796 - Embedded printed circuit board and method of manufacturing the same (2012-12-25),

14. 8305766 - Electronic component-embedded printed circuit board and method of manufacturing the same (2012-11-06),

Title: Inventor Jin Seon Park

Introduction: Jin Seon Park is a renowned inventor based in Seoul, South Korea, known for his groundbreaking contributions to various technological fields.

Latest Patents: Jin Seon Park holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Jin Seon Park has worked with leading research institutions and companies to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Jin Seon Park has collaborated with top universities and multinational corporations, fostering a culture of innovation and knowledge sharing in the global tech community.

Conclusion: Jin Seon Park's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.