The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Dec. 17, 2010
Sang Chul Lee, Gyunggi-do, KR;
Jung Soo Byun, Gyunggi-do, KR;
Jin Seon Park, Chungcheongnam-do, KR;
Doo Hwan Lee, Gyunggi-do, KR;
Sang Chul Lee, Gyunggi-do, KR;
Jung Soo Byun, Gyunggi-do, KR;
Jin Seon Park, Chungcheongnam-do, KR;
Doo Hwan Lee, Gyunggi-do, KR;
Samsung Electro-Mechanics, Co., Ltd, Suwon, Gyunggi-Do, KR;
Abstract
Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.