Gyunggi-do, South Korea

Jung Soo Byun

USPTO Granted Patents = 4 

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 22(Granted Patents)


Location History:

  • Gyunggi-do, KR (2012 - 2015)
  • Anyang, KR (2016)

Company Filing History:


Years Active: 2012-2016

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations of Jung Soo Byun

Introduction

Jung Soo Byun is a notable inventor based in Gyunggi-do, South Korea. He has made significant contributions to the field of electronics, particularly in the development of advanced printed circuit boards (PCBs) and semiconductor packages. With a total of 4 patents to his name, Byun's work has had a substantial impact on the industry.

Latest Patents

Jung Soo Byun's latest patents include a chip-embedded printed circuit board and a semiconductor package utilizing this PCB. The manufacturing method of the PCB involves a chip-embedded design that enhances the functionality and efficiency of electronic devices. His semiconductor package features a package on package (PoP) structure, which includes upper and lower semiconductor packages. The lower package consists of a base substrate with circuit patterns, an electronic component embedded within, and a heat dissipation member to manage heat generated by the component. Additionally, Byun has developed a printed circuit board that accommodates electronic components within a metal core layer, ensuring effective grounding and circuit functionality.

Career Highlights

Jung Soo Byun is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in advancing the technology behind PCBs and semiconductor packages, making them more efficient and reliable.

Collaborations

Some of Jung Soo Byun's coworkers include Suk Chang Hong and Sang Kab Park. Their collaborative efforts contribute to the innovative environment at Samsung Electro-Mechanics Co., Ltd.

Conclusion

Jung Soo Byun's contributions to the field of electronics through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a leading inventor in the industry. His innovations in printed circuit boards and semiconductor packages are paving the way for future advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…