The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Dec. 17, 2010
Applicants:

Suk Chang Hong, Chungcheongbuk-do, KR;

Bong Kyu Choi, Chungcheongbuk-do, KR;

Je Gwang Yoo, Gyunggi-do, KR;

Sang Wuk Jun, Chungcheoungbuk-do, KR;

Sang Kab Park, Chungcheoungbuk-do, KR;

Jung Soo Byun, Gyunggi-do, KR;

Inventors:

Suk Chang Hong, Chungcheongbuk-do, KR;

Bong Kyu Choi, Chungcheongbuk-do, KR;

Je Gwang Yoo, Gyunggi-do, KR;

Sang Wuk Jun, Chungcheoungbuk-do, KR;

Sang Kab Park, Chungcheoungbuk-do, KR;

Jung Soo Byun, Gyunggi-do, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/5389 (2013.01); H05K 3/4608 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 23/49827 (2013.01); H05K 3/4661 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/15153 (2013.01);
Abstract

Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.


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