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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9392698 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Dec. 11, 2013

Chip-embedded printed circuit board and semiconductor package using the pcb, and manufacturing method of the pcb

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Suk Chang Hong, Yeongi, KR;

Jung Soo Byun, Anyang, KR;

Sang Kab Park, Cheongju, KR;

Kwang Seop Youm, Yeongi, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

A Sefer

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 25/105 (2013.01); H05K 1/0209 (2013.01); H05K 1/185 (2013.01); H05K 3/465 (2013.01); H01L 23/49816 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24246 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18162 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor package using a chip-embedded printed circuit board (PCB) includes upper and lower semiconductor packages having a package on package (PoP) structure, wherein the lower semiconductor package includes a base substrate including predetermined circuit patterns formed therein; an electronic component electrically connected to the circuit pattern and embedded in the base substrate such that one surface thereof is exposed to an upper surface of the base substrate; and a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside.

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