Shenzhen, China

Jin-Biao Liu

USPTO Granted Patents = 11 

Average Co-Inventor Count = 2.6

ph-index = 7

Forward Citations = 98(Granted Patents)


Location History:

  • Guangdong, CN (2010)
  • Shenzhen, CN (2007 - 2013)

Company Filing History:


Years Active: 2007-2013

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11 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jin-Biao Liu

Introduction

Jin-Biao Liu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronics, particularly in the development of heat dissipation technologies. With a total of 11 patents to his name, Liu's work has had a considerable impact on the efficiency and performance of electronic components.

Latest Patents

One of Liu's latest patents is a light-emitting diode lamp that incorporates a sophisticated heat dissipation device. This device is designed to effectively dissipate heat from electronic components mounted on printed circuit boards. It features a fin unit, a centrifugal fan positioned adjacent to the fin unit, and a heat-conducting board that is attached to the electronic component. Additionally, a heat pipe thermally connects the fin unit and the electronic component, ensuring optimal thermal management. The design includes an engaging portion that protrudes upwardly from the top face of the heat-conducting board, enhancing its functionality.

Career Highlights

Throughout his career, Jin-Biao Liu has worked with notable companies such as Foxconn Technology Co., Ltd. and Fu Zhun Precision Industry (Shenzhen) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Liu has collaborated with several talented individuals in the field, including Chun-Chi Chen and Shih-Hsun Wung. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies.

Conclusion

Jin-Biao Liu's contributions to the field of electronics, particularly in heat dissipation technologies, highlight his innovative spirit and dedication to improving electronic component performance. His patents and collaborations reflect a commitment to advancing technology in meaningful ways.

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