The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Dec. 01, 2006
Jin-biao Liu, Shenzhen, CN;
Guang Yu, Shenzhen, CN;
Shih-hsun Wung, Taipei Hsien, TW;
Chun-chi Chen, Taipei Hsien, TW;
Jin-Biao Liu, Shenzhen, CN;
Guang Yu, Shenzhen, CN;
Shih-Hsun Wung, Taipei Hsien, TW;
Chun-Chi Chen, Taipei Hsien, TW;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device assembly is mounted on a printed circuit board (). First and second electronic components () are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink () in thermal contact with the first electronic component, and a second heat sink () in thermal contact with the second electronic component. A spring tab () is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile