Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Jin-Biao Liu

Chun-Chi Chen

Shih-Hsun Wung

Guang Yu

Da-Yuan Zhou

Hong-Cheng Yang

Shi-Song Zheng

Chin-Chung Chen

He-Ping Liu

Xin-Lei Liu

Light emitting diode lamp

A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.

Heat dissipation device and method for manufacturing the same

A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.

Toolless locking device

A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.

Heat dissipation device

A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.

Heat sink

A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

Heat dissipation device with heat pipe

A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.

Heat dissipation device having a fan holder for attachment of a fan

A heat dissipation device assembly is mounted on a printed circuit board (). First and second electronic components () are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink () in thermal contact with the first electronic component, and a second heat sink () in thermal contact with the second electronic component. A spring tab () is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.

Heat dissipation device assembly

A heat dissipation device in a computer enclosure includes a heat spreader () mounted on a CPU (), a first heat sink (), a cooling fan () coupled to the first heat sink, a second heat sink (), a heat pipe () mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan () attached to the second heat sink, and a fan duct () interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.

Electronic cooling system having a ventilating duct

A heat sink includes a fin assembly () including a plurality of fin plates () and a fan () mounted on the fin assembly. Each fin plate includes a plurality of cutouts () defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.

A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.

Growing community of inventors

Shenzhen, China

Jin-Biao Liu