The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2008

Filed:

Jan. 19, 2006
Applicants:

Chun-chi Chen, Shenzhen, CN;

Shih-hsun Wung, Shenzhen, CN;

Guang Yu, Shenzhen, CN;

Da-yuan Zhou, Shenzhen, CN;

Jin-biao Liu, Shenzhen, CN;

Inventors:

Chun-Chi Chen, Shenzhen, CN;

Shih-Hsun Wung, Shenzhen, CN;

Guang Yu, Shenzhen, CN;

Da-Yuan Zhou, Shenzhen, CN;

Jin-Biao Liu, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/00 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device in a computer enclosure includes a heat spreader () mounted on a CPU (), a first heat sink (), a cooling fan () coupled to the first heat sink, a second heat sink (), a heat pipe () mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan () attached to the second heat sink, and a fan duct () interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.


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