San Jose, CA, United States of America

Jim Chin-Nan Ni

This inventor holds 53 USPTO granted patents, primarily in USB Flash Drive Technology (CPC class H01L). Top assignees: Super Talent Electronics, Inc., Super Talent Technology, Corp.. Active years: 2006-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jim Chin-Nan Ni. Retrieved from https://idiyas.com/inventor/jim-chin-nan-ni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.6

ph-index = 16

Forward Citations = 764(Granted Patents)

Forward Citations (Not Self Cited) = 722(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:


Years Active: 2006-2016

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Areas of Expertise:
USB Flash Drive
Dual-Personality Plugs
Swivel Cover
MLC Memory
Retractable Connector
Secure-Digital Card
Metal Housing
High Throughput Manufacturing
Low-Power Device
Flash Memory Assembly
Embedded Applications
Heat-Sink Plates
53 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Jim Chin-Nan Ni

Introduction: Jim Chin-Nan Ni, based in San Jose, California, is a prolific inventor with an impressive portfolio of 53 patents. His work primarily focuses on advancing technology in the field of USB and electronic device packaging, showcasing his innovative spirit and technical expertise.

Latest Patents: Among his most notable recent inventions is a groundbreaking molding method for COB-EUSB devices and metal housing packages. This dual-personality extended USB (EUSB) system is designed to support both USB and EUSB devices through an extended 9-pin EUSB socket. Each EUSB device features a printed circuit board assembly (PCBA) that integrates four standard USB metal contact pads along with several extended purpose contact springs located on the upper side of the PCB. The invention utilizes a single-shot molding process to encase passive components and integrated circuit (IC) dies on the lower surface of the PCB. The mounting of passive components is executed using surface-mount technology (SMT), while IC dies are installed via chip-on-board (COB) methods. The extended socket configuration also allows for modular insert options, providing EUSB assemblies with a plug shell that resembles standard USB male connectors.

Career Highlights: Jim has significantly contributed to the technological landscape through his work at Super Talent Electronics, Inc. and Super Talent Technology Corporation. His efforts have not only advanced product functionalities but also enhanced user experience in electronic devices.

Collaborations: Throughout his career, Jim has collaborated with esteemed professionals such as Abraham C. Ma and Ming-Shiang Shen. These collaborations have facilitated the sharing of knowledge and the fusion of innovative ideas, driving forward the advancements in their collective projects.

Conclusion: Jim Chin-Nan Ni's contributions to the field of technology exemplify the power of innovation. With 53 patents to his name, his inventive endeavors continue to shape the future of electronic device interfacing and packaging. His dedication to improving technology through inventive solutions sets a commendable example for aspiring inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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