The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
May. 28, 2008
Siew S. Hiew, San Jose, CA (US);
Frank I-kang Yu, Palo Alto, CA (US);
David Q. Chow, San Jose, CA (US);
Jim Chin-nan NI, San Jose, CA (US);
Nan Nan, San Jose, CA (US);
Abraham C. MA, Fremont, CA (US);
Ming-shiang Shen, Taipei, TW;
Siew S. Hiew, San Jose, CA (US);
Frank I-Kang Yu, Palo Alto, CA (US);
David Q. Chow, San Jose, CA (US);
Jim Chin-Nan Ni, San Jose, CA (US);
Nan Nan, San Jose, CA (US);
Abraham C. Ma, Fremont, CA (US);
Ming-Shiang Shen, Taipei, TW;
Super Talent Electronics, Inc., San Jose, CA (US);
Abstract
According to certain embodiments of the invention, a flash memory card is manufactured using COB processes on a PCB panel with multiple micro cards PCB substrates. These micro memory cards are laid out in an array of 3×5 matrixes of micro cards PCB substrates. A method of molding over a PCBA is utilized, contrary to a conventional method of having two or more pieces of package components to tape together. This results in a simpler structure without the notch which enables easier singulation process and the package is moisture resistance. The final product is a single piece versus two or three pieces glued up pieces and would not separate from pieces. The final product has high water and moisture resistance, low cost and fast manufacturing throughput, no seam and aesthetically more appeasing, can stack more layers of flash memory die, and be maximized XY spaces to accommodate larger size flash memory die.