Company Filing History:
Years Active: 2014-2022
Title: Innovations of Jianli Cui in Resistivity Probes
Introduction
Jianli Cui is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of resistivity probes, particularly in their application for testing integrated circuits. With a total of 5 patents to his name, Jianli has established himself as a key figure in the industry.
Latest Patents
One of Jianli Cui's latest patents involves resistivity probes with curved portions. These probes are designed to test integrated circuits effectively. In this innovation, a resistivity probe features a substrate with multiple vias and metal pins, each extending out of the substrate. Interconnects provide the necessary electrical connections to these metal pins. Another notable patent focuses on the dynamic determination of metal film thickness from sheet resistance and temperature coefficient of resistivity (TCR) values. This method allows for accurate measurements of metal film thickness while minimizing variations caused by resistivity. A probe head equipped with a temperature sensor is utilized during these measurements, ensuring precision.
Career Highlights
Jianli Cui is currently employed at Kla Tencor Corporation, where he continues to develop innovative technologies in the field of resistivity probes. His work has been instrumental in advancing the capabilities of testing integrated circuits.
Collaborations
Jianli collaborates with talented coworkers, including Nanchang Zhu and Lu Yu, who contribute to the innovative environment at Kla Tencor Corporation.
Conclusion
Jianli Cui's contributions to the field of resistivity probes highlight his expertise and commitment to innovation. His patents reflect a deep understanding of the technology and its applications in integrated circuit testing.