The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Feb. 24, 2017
Kla-tencor Corporation, Milpitas, CA (US);
Xianghua Liu, Shanghai, CN;
Walter Johnson, Rocklin, CA (US);
Jianli Cui, Shanghai, CN;
Lu Yu, Shanghai, CN;
Nanchang Zhu, Shanghai, CN;
Juli Cheng, Zhubei, TW;
Huanglin Li, Shanghai, CN;
Liming Liu, Shanghai, CN;
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.