This inventor holds 2 USPTO granted patents. Top assignee: Kla Tencor Corporation. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: Huanglin Li: Innovator in Metal Film Thickness Measurement
Introduction
Huanglin Li is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of metal film thickness measurement, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
One of Huanglin Li's latest patents is focused on the dynamic determination of metal film thickness from sheet resistance and temperature coefficient of resistivity (TCR) value. This invention allows for the accurate measurement of metal film thickness by utilizing sheet resistance, resistivity, and TCR. The method effectively reduces or eliminates variations in film thickness measurements caused by resistivity. A probe head is employed for some measurements, which includes a temperature sensor used during sheet resistance measurements. Additionally, a wafer on a chuck is heated, either by the chuck or the probe head, to facilitate these measurements.
Career Highlights
Huanglin Li is currently associated with Kla Tencor Corporation, a company known for its advanced technology solutions. His work at Kla Tencor has positioned him as a key player in the development of innovative measurement techniques.
Collaborations
Huanglin Li collaborates with notable colleagues, including Xianghua Liu and Walter F Johnson. Their combined expertise contributes to the advancement of technology in their field.
Conclusion
Huanglin Li's contributions to the measurement of metal film thickness demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of the complexities involved in this area, making him a valuable asset to the industry.