Company Filing History:
Years Active: 2020
Title: Innovations by Juli Cheng
Introduction
Juli Cheng is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of technology, particularly in the area of metal film thickness measurement. With a total of 2 patents, his work has garnered attention for its innovative approach and practical applications.
Latest Patents
One of Juli Cheng's latest patents is focused on the dynamic determination of metal film thickness from sheet resistance and temperature coefficient of resistivity (TCR) value. This invention allows for the accurate measurement of metal film thickness by utilizing sheet resistance, resistivity, and TCR. The method effectively reduces or eliminates variations in film thickness measurements caused by resistivity. A probe head is employed for some measurements, which includes a temperature sensor used during sheet resistance assessments. Additionally, a wafer on a chuck is heated, either by the chuck or the probe head, to facilitate these measurements.
Career Highlights
Juli Cheng is currently associated with Kla Tencor Corporation, a company known for its advanced technology solutions. His work at the company has been instrumental in developing innovative measurement techniques that enhance the accuracy and reliability of metal film thickness assessments.
Collaborations
Juli has collaborated with several talented individuals in his field, including Xianghua Liu and Walter F Johnson. These collaborations have contributed to the advancement of technology and the successful development of his patents.
Conclusion
Juli Cheng's contributions to the field of technology through his patents and work at Kla Tencor Corporation highlight his innovative spirit and dedication to advancing measurement techniques. His inventions continue to impact the industry positively.