Company Filing History:
Years Active: 2020
Title: Liming Liu: Innovator in Metal Film Thickness Measurement
Introduction
Liming Liu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of metal film thickness measurement, holding a total of 2 patents. His work focuses on improving the accuracy and efficiency of measuring metal film thickness, which is crucial in various technological applications.
Latest Patents
One of Liming Liu's latest patents is titled "Dynamic determination of metal film thickness from sheet resistance and TCR value." This innovative method allows for the determination of metal film thickness using sheet resistance, resistivity, and the temperature coefficient of resistivity. The invention addresses the variations in film thickness measurements caused by resistivity, providing a more reliable measurement process. A probe head is utilized for some measurements, which includes a temperature sensor to enhance the accuracy during sheet resistance measurements. Additionally, a wafer on a chuck is heated, either by the chuck or the probe head, to facilitate the measurements.
Career Highlights
Liming Liu is currently employed at Kla Tencor Corporation, where he continues to develop and refine his inventions. His expertise in the field has positioned him as a valuable asset to the company, contributing to advancements in measurement technologies.
Collaborations
Throughout his career, Liming Liu has collaborated with notable colleagues, including Xianghua Liu and Walter F Johnson. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the industry.
Conclusion
Liming Liu's contributions to the field of metal film thickness measurement exemplify his dedication to innovation and excellence. His patents and work at Kla Tencor Corporation highlight his role as a leading inventor in this specialized area.