Jian Zuo

Title: The Innovative Contributions of Jian Zuo

Introduction

Jian Zuo is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor technology. With a total of six patents to his name, Zuo has made remarkable advancements that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

One of Jian Zuo's latest patents is focused on a semiconductor device and method of forming a hybrid substrate with uniform thickness. This innovation involves a first hybrid substrate with a specific thickness and a second hybrid substrate with a different thickness. An encapsulant is deposited around both substrates, allowing for the removal of portions after encapsulation to achieve uniform thickness. The first hybrid substrate features an embedded substrate with interconnect structures, while conductive pillars and vias are formed to enhance connectivity. Another notable patent involves a split RDL connection between a semiconductor die and under-bump metallization (UBM). This design includes multiple contact pads and conductive traces that improve electrical connections while isolating certain pads from the UBM.

Career Highlights

Throughout his career, Jian Zuo has worked with esteemed organizations such as Stats Chippac Pte. Ltd. and the National University of Singapore. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in semiconductor technology.

Collaborations

Jian Zuo has collaborated with notable colleagues, including Xusheng Bao and Ma Phoo Pwint Hlaing. These partnerships have fostered an environment of innovation and creativity, leading to the development of advanced semiconductor solutions.

Conclusion

Jian Zuo's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a commitment to improving device performance and functionality, making him a significant figure in the industry.