The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Aug. 18, 2021
Stats Chippac Pte. Ltd., Singapore, SG;
Jian Zuo, Singapore, SG;
Yaojian Lin, Jiangyin, CN;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A semiconductor device has a semiconductor die. A first contact pad, second contact pad, and third contact pad are formed over the semiconductor die. An under-bump metallization layer (UBM) is formed over the first contact pad, second contact pad, and third contact pad. The UBM electrically connects the first contact pad to the second contact pad. The third contact pad is electrically isolated from the UBM. Conductive traces can be formed extending between the first contact pad and second contact pad under the UBM. A fourth contact pad can be formed over the first contact pad and a fifth contact pad can be formed over the second contact pad. The UBM is then formed over the fourth and fifth contact pads.