Shanghai, China

Jian Lu

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Jian Lu

Introduction

Jian Lu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of technology, particularly in wireless power communication and packaging structures. With a total of six patents to his name, his work reflects a commitment to advancing modern technology.

Latest Patents

One of Jian Lu's latest patents is a "Wireless power communication apparatus and method." This innovative apparatus includes a rectifier coupled to a receiver coil, which is designed to be magnetically coupled to a transmitter coil of a wireless power transfer system. The rectifier converts alternating current voltage into direct current voltage. Additionally, it features a first communication apparatus for low-speed communication and a second communication apparatus for high-speed communication with the transmitter, enabling efficient data transfer. Another notable patent is a "Packaging structure," which consists of multiple first chips and a molding layer that covers the sidewall of the chips while exposing their top surfaces.

Career Highlights

Jian Lu has worked with leading companies in the semiconductor industry, including Semiconductor Manufacturing International Corporation in Shanghai and Beijing. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in the semiconductor field.

Collaborations

Jian Lu has collaborated with notable colleagues such as Fu Cheng Chen and Honghao Wu. Their teamwork has fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Jian Lu's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in wireless power communication and packaging structures.

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